1. Adopt imported laser light sourc÷βe with high beam quality and small focβ≥™↔using spot to make marki÷≈©ng more precise and clea÷ rer;

2. Fully cold light ÷$♣★source, the heat affected areε♣☆≈a is extremely small, and no th₩ ↔ermal effect will be generated, so a≈≤π₩s to avoid deformation, damageε≥↑→ or burning of the proce₩γ£∑ssed materials;

3. A wide range of applicable materiδ&als, which solves the probδ•δγlems that many mater®✘∑£ials are not delicate enough wit£ ×☆h fiber laser marking and hav£σe poor results;

4. Fast marking speed and high≤ε•☆ efficiency.

Mainly used in the high-end maφ•rket of ultra-fine processing, λ 3C industry marking, ∑≥γ↔marking of electronic components<&€≤, electrical enclosures, marking of pa∑↑≈✘ckaging bottles for food ♥, medicine and other polymer materia↔≤ls; removal of metalε≤ or non-metallic coatings; marking o ™f various materials Grooveπ‍£ treatment; new ultra-thin metal foilγγ• micro-hole production, etc.