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Desktop Split UV Laser Marking Machine
Desktop Split UV Laser Marking Machine$β¥
Specifications:

Equipment model: ZM-E3-3 /ZM-E3-5±>δ

Laser power: 3W /5W

Laser wavelength: 3 ε55nm

Beam quality (M2): ≤1.∏♣σ¥2

Laser repetition frequency: 20÷Ωφ~200KHz

Marking range: ≤300×300(mm)

Maximum line speed: ו 12000mm/s

Minimum line width: 0.01mm

Minimum character: 0.06

Cooling method: air coolin"₹×πg/water cooling

Power consumption of the whole¥☆×™ machine: 700W, 900W

Power demand: 220V/50Hz

Appearance size: 320×850×66 ∑0mm

Feature description

1. Imported laser light source is adop↑>™βted, with high beam qualitα'¥λy and small focusing spot,↓✘× making the marking more precise and c©★∏≈learer;

2. All cold light source, the heat-afβ↕φ£fected area is extremely small, no theβ&₩"rmal effect will be produced$'•, and the processed material will be‍∏ prevented from being deformed, d♠'≤↑amaged or scorched;

3. A wide range of applicable m♣₩aterials, which solves the ©€♦↑problems that the marking of many mate§≤"rials with fiber laser is ∏÷©∏not delicate enough and the effect i©± €s not good;

4. The marking speed is fast and the e←$β←fficiency is high;

5. Desktop design, small size, e♦↕asy to move;

6. Any office computer ©≥Ωσcan be used for drawin←≈g and marking, eliminating the need for>≥γ graphics conversion between differ✔♥ent computers.

Application area

Mainly used in the high-end market  <→of ultra-fine processing, 3C ind$₹​ustry marking, electronic components, eεΩ←δlectrical shell marking, pa→"ckaging bottle marking of÷λ™‍ food, medicine and oth₩∞•&er polymer materials; metal or₽→ non-metallic coating removal; scribi  →ng of various materials, blind Slo &t processing; new ultra-thin me↕™tal foil micropore f→£®§abrication, etc.

Sample show

Online

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Manager Wen: 18902563402

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