1. Adopt imported laserλα×$ light source with hig↔ &h beam quality and small focusγ₹↔ing spot to make marking more precisβ§✔©e and clearer;

2. Fully cold light source, th≥'γσe heat affected area i≤✔​&s extremely small, and no thermal eff₽☆₹®ect will be generated, so as to avφ≤σoid deformation, damage or burning of ∑∏↕the processed materials;

3. A wide range of applicable mε©£aterials, which solves th★ ₩≤e problems that many materials ≠↓•are not delicate enough with fiberφ±♥ laser marking and have po¶δor results;

4. Fast marking speed and high efficien↑↑¶ cy.

Mainly used in the high-end market of u≠★ltra-fine processing, 3C indus≤&§try marking, marking of electronicε£ components, electriγβcal enclosures, marki​✔ ≤ng of packaging bottles for food↑$★, medicine and other poly ‍§mer materials; removal of meta¥↕σl or non-metallic coatings; marking of ★♣various materials Groov♣♥£e treatment; new ultra-thin metal foil★☆©≈ micro-hole production,βπ etc.