1. The beam quality is good, close to t®Ω₽₽he diffraction limit, so that∑®♣< more fine marking can be achieved;

2. Adopt optical fiber oβ♦utput, configure high-speed dig  ‍>ital scanning head, marking s✔δ÷peed is 2-3 times that of traditional m >♠®odels;

3. The electro-optical conversion rate  ​¥is as high as 30%, and th↔↓Ωe power consumption is about 10%→← of traditional models;

4. Air cooling is adopted, and the§≥λα whole machine is compact;

5. No consumables, maintenance-f≥↔&ree, and long service life;

6. Six-axis linkage;

7. Optoelectronic positioning;

8. Infrared laser positioning;

9. Gantry structure;

10. High engraving precision and goo¶'d stability, especially suitable fo∞☆r the processing of complex graphics.₹→φ

Mainly used for deep c‍®$★arving and carving of hardwa≈®re products, precisiβ↕​₩on instruments, die steel, common metal♠∞≤∏s and alloys (iron, copper, ♥→←aluminum, magnesium, zinc, etc.©≈&∞). It can also be used for marking of m§↔→etal materials and some non-met↔≈allic materials, as well as sh>☆eet cutting.